An updated report to weight the strength and weakness of existing 3D ICs technologies, and see who is the key players int he area of of 3D packaging.

 

This report highlights the market leaders for 3D packaging technologies, the status of developments, how it will affect the semiconductor food chain. Also includes equipments market forecasts and technical analyses of the different solutions with extensive exclusive technical explanation, figures and abstracts.

 

IC, MEMS and image sensors markets will be affected by 3D integration.

Semiconductor chips face steady pressure for increased performances while still decreasing its size and at the same time their packages must be able to include new functionalities. The expanding consumer electronics market is a mainly strong driver of packaging innovations such as 3D ICs. Today wire bonding is limited in density and performances so 3D stacking with micro-vias seems to be inevitable in the future for miniaturization first and increased performances after.

 

3D integration will use technologies originally developed for MEMS technology but for different markets. In our report, we have analyzed that portable applications are a strong market driver for 3D integration. Stacking memories, image sensors with P and FPGAs will be the first mass market applications. In 2010, we forecast that 1 billion of Flash memories will be stacked with TSVs.